Summary
Cheng-yi Lin is a product characterization and yield management engineer with nine years of experience at IBM, specializing in data-driven root-cause analysis for 14nm/22nm high-performance server processors. He combines device-physics expertise from UCLA and National Tsing Hua University with hands-on data engineering skills—Python, SAS, SQL, Dash—and has built automated pipelines and visualization tools to accelerate yield improvement. Cheng-yi’s background in TCAD, ADC/FFT implementation, and sensor readout hardware gives him a rare cross-disciplinary view that connects semiconductor process nuances to actionable analytics. At IBM he has driven investigations into eDRAM failure patterns, implemented daily regression analyses via cron-enabled scripts, and coordinated multi-team failure analysis to improve manufacturability. Based in East Fishkill, NY, he brings both lab-level circuit and materials research experience and production-scale data mining to tackle complex semiconductor yield challenges.
9 years of coding experience
8 years of employment as a software developer
University of California, Los Angeles
Master's Degree Electrical and Electronics Engineering, Master's Degree Electrical and Electronics Engineering at National Tsing Hua University
English, Chinese