Rui Zhang
Sr. Staff Packaging Module Development Engineer at Intel Corporation
Chandler, Arizona, United States
Summary
👤
Senior🎓
Top SchoolRui Zhang is a Sr. Staff Packaging Module Development Engineer at Intel with 12 years of hands-on experience in semiconductor packaging materials, assembly processes and integration—particularly FCBGA and FCCSP. He holds a PhD in Polymer Materials from Carnegie Mellon and combines deep materials science expertise with practical process development to lead complex packaging programs. Known for strong technical leadership and clear communication, he consistently delivers solutions in high-pressure, cross-functional environments. Rui’s background in polymer chemistry enables him to bridge fundamental materials research and scalable manufacturing, making him adept at solving both lab-scale and production challenges. Based in Chandler, Arizona, he brings a rare blend of academic depth and industrial execution to semiconductor packaging innovation.
12 years of coding experience
Master of Science - MS Physical Chemistry, Master of Science - MS Physical Chemistry at Jilin UniversityDoctor of Philosophy - PhD Polymer Materials, Doctor of Philosophy - PhD Polymer Materials at Carnegie Mellon University
Github Skills (21)
networking10
driver10
openstack9
opendaylight9
5g7
opendev7
openstack-neutron6
cicd5
continuous-integration5
testing4
devops4
edge-computing4
cisco3
kubernetes3
git3
Programming languages (3)
Github contributions (5)
rzang-intel/GenAIInfra
Aug 2024 - Aug 2024
Containerization and cloud native suite for OPEA
Contributions:2 PRs, 15 pushes, 2 branches in 4 days
openstack/networking-odl
Jun 2014 - Dec 2016
DEPRECATED, Neutron drivers for OpenDaylight. Mirror of code maintained at opendev.org.
Contributions:17 commits in 2 years 6 months
driveropendaylight
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