Yang Jiao
Chip Packaging Technologist at Google
San Jose, California, United States
Summary
👤
Senior🎓
Top SchoolYang Jiao is a chip packaging technologist with a Ph.D. in chemical engineering and eight years of hands-on experience designing porous materials, electrodes, graphene composites, membranes, and heterogeneous catalysts. He has deep expertise in semiconductor assembly and test materials, leading materials integration for backend test modules, SMT and wafer prep, and developing TIMs, pogo pins, test sockets, underfills, and solder processes. His background pairs advanced materials R&D and characterization—viscoelastic properties, failure analysis, and root-cause investigations—with practical process pathfinding that directly improved test reliability and product validation. He has held progressive packaging roles at Intel and Google, often bridging lab-scale materials science with high-volume manufacturing constraints. Based in San Jose, he combines academic rigor from Georgia Tech with startup and venture exposure, giving him both analytical depth and product-focused judgment. Colleagues rely on him for tough failure analyses and for translating novel material concepts into robust assembly and test solutions.
9 years of coding experience
11 years of employment as a software developer
Doctor of Philosophy (Ph.D.) Chemical Engineering, Doctor of Philosophy (Ph.D.) Chemical Engineering at Georgia Institute of TechnologyBachelor of Science (BS) Chemical Engineering, Bachelor of Science (BS) Chemical Engineering at Tianjin University
English, Chinese
Github Skills (45)
python9
gpu9
visual-question-answering9
deep-learning8
style-transfer8
optical-flow8
machine-learning8
sass8
numpy8
javascript8
face8
tensor7
attention-model7
neural-network7
siggraph7
Programming languages (4)
Github contributions (5)
JohnnieXDU/EmotionUI
Dec 2021 - Dec 2021
Contributions:39 commits, 26 pushes, 1 branch in 10 days
JohnnieXDU/JohnnieXDU.github.io
Dec 2021 - Jan 2022
Contributions:63 pushes, 1 branch in 17 days
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